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STM-UV C Series Laser Marking Machines

STM-UV C Series Laser Marking Machines
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System Description

STM-UV C Series is the 3rd generation laser marking system developed with special light source by Suntec. The machine uses UV laser generator to create laser through the high-speed Galvanometer scanning system. The UV laser marking system has the advantage of high electrical light conversion efficiency, water cooling, compact size, good quality of output beam, high reliability, long operating life, less consumption. It can be used for carving metal materials and non-metal materials, mainly used for the application with strict requirements of depth, smoothness and high precision.


TECHNICAL SPECIFICATIONS

ITEM

STM-UV 3C Laser Marking Machine

STM-UV 5C Laser Marking Machine

Laser power

3W

5W

Wavelength

355nm

355nm

Beam quality M2

<2

<2

Laser repetition frequency

20KHz -100KHz

20KHz -100KHz

Marking size

100mm×100mm (or customization)

100mm×100mm (or customization)

Marking Speed

≤15000mm/s

≤8000mm/s

Minimum line width

0.01mm

0.01mm

Minimum character

0.1mm

0.1mm

Repetition precision

±0.003mm

±0.005mm

Gross power

≤1000W

≤1000W

Power Supply

AC220V/Single phase/ 50/60Hz /10A

AC220V/Single phase/ 50/60Hz /10A

Cooling way

Water cooling

Water cooling

Temperature

10°c to 35°c

10°c to 35°c

Humidity

5% to 60%( No condensed water)

5% to 60%( No condensed water)

Net weight

100KG

100KG

Dimension

845 mm ×1200mm ×1720 mm

700mm×900mm×1380mm




FEATURE

All in one structure with manual focusing system and user-friendly operation.
  • Applicable to a wide range of materials;
  • Good beam quality, small focused laser spot, enabling super-fine marking;
  • Small heat-affected zone, avoiding damaging the material; high yield rate;
  • High marking speed, high efficiency and high precision;
  • No consumables are required, thereby reducing cost and maintenance expenses;
  • Overall performance is stable, suitable for continuous long-time operation;
  • Rotary worktable is used for marking.

APPLICATION AREA

  • Marking and piercing of food packaging materials, PVC pipes and medical packaging materials (HDPE, PO, PP, etc.); piercing, with hole diameter d≤10μm.
  • Marking and slicing of flexible PCB boards.
  • Removing metal or non-metal coatings.
  • Processing micro-holes and blind holes of silicon wafers.

SAMPLE

stm-uv3c-sample
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  • TEL:+86-755-23572117
  • EMAIL:info@sunteclaser.com
  • ADDRESS:709, Meiying Intelligence Bay, 107 National Road, Fuyong Residential District, Bao'an, Shenzhen, Guangdong, China, 518128